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100 mm

Part ID

Description

Top Wafer Specification

Base WaferSpecification

Min. Q'ty

Si Thic.

SiO2 Thic.

Crystal

Ori.

Res.

Crystal

Res.

Wafer Thic.(um)

40000M

3400

4000

FZ

<100>

14-22

CZ

14-22

525

10

40008P

3400

4000

FZ

<100>

14-22

FZ

>2,000

525

10

40020P

3400

4000

FZ

<100>

14-22

CZ-DSP

14-22

450

10



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