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 ¢º °ßÀûÀÇ·Ú ¤Ó ¢º SPEC: 1 2 3

 

 

Metallization SPEC

 

High Reflective Chrome(HRC)

Mid-Reflective Chrome(MRC)

Low Reflective Chrome(LRC)

   Optical Density @ 436 nm

2.7 ±0.2

2.7 ±0.2

2.7 ±0.2

   Deviation within active area

< ±0.1

< ±0.1

< ±0.1

   Reflectivity @ 436 nm

48 ±2 (%)

33 ±2 (%)

11 ±2 (%)

   Film Thickness

700A

850A

1000A

   Film Adhesion

Excellent

Excellent

Excellent

   Acid Resistance (conc. H2SO4; 120º C)

> 120 min

> 120 min

> 120 min

   Acid Resistance (conc. H2SO4(4) -

   H2O2(1); 70-95º C)

>120 min

>120 min

> 120 min

   Pinholes @ 1-4 ¥ì after U.S. IPA for 2 min.

< 0.05 p.h./cm2

< 0.05 p.h./cm2

< 0.05 p.h./cm2

   Wet Etching, Etch time (dip)

45 ±5 sec

47 ± 5 sec

50 ±5 sec

   Etch time (APT)

35 ±3 sec

37 ±3 sec

40 ±3 sec

   Undercut rate(APT, both sides)

0.1 ¥ìm/10 sec

0.1 ¥ìm/10 sec

0.1 ¥ìm/10 sec


* WET ETCH CONDITIONS
* Temperature: 20º C ±0.1±º
* Etchant - Microchrome CEA-100 Cyantek CR-75

 

Iron Oxide(IO)

Optical Density @ 5800A

0.3-0.5

Optical Density @ 4000A

2.0-2.5